Micron 5300 PRO 960GB 2.5 SSD

R5,410.13

Maximize your data center with the performance, consistency, and expanded data security of the Micron 5300 SATA SSD. Built with Micron’s innovative 96-layer 3D TLC NAND, the Micron 5300 series combines the latest in NAND technology and a proven architecture to provide performance upgrades now and a path forward for moving to an all-flash future.

98 in stock

SKU MTFDDAK960TDS-1AW1ZABYY

    Built with Micron’s innovative 96-layer 3D TLC NAND, the Micron 5300 series combines the latest in NAND technology and a proven architecture to provide performance upgrades now and a path forward for moving to an all-flash future. The 5300’s high capacity, added security, and enhanced endurance enable strong performance.

    Features:

    • Industry’s first 96-layer 3D TLC NAND
    • Flex capacity
    • AES 256-bit encryption
    • TCG Enterprise configurability
    • TCG Opal
    • Power loss protection for data at-rest and inflight,
    • Enterprise data path protection for user and meta data
    • Secure firmware
    • Adaptive thermal monitoring
    • Easy to install (hot-pluggable)
    • Storage Executive SSD management tool
    • RAIN

    Specifications:

    • Capacity: 960 GB
    • Sequential reads (MB/s): 540
    • Sequential writes (MB/s): 520
    • Random reads (K IOPS): 95
    • Random writes (K IOPS): 35
    • Endurance (Total Bytes Written in TB): 2628
    • Interface: SATA (6 Gb/s)
    • Form factor: 2.5″
    • NAND: Micron 96-layer 3D TLC NAND
    • 99.9% Latency: Random read:9 175µs to 200µs; Random write:9 100µs to 650µs
    • MTTF: 3 million device hours
    • UBER: <1 sector per 10¹⁷ bits read
    • Power Consumption:
    • Seq Write: <3.9W MAX9
    • Seq Read: <3W MAX9
    • Temperature (operating): 0-70°C
    • Size: 10.04 x 6.98 x 0.7 cm
    • Weight: <70g

    What’s In The Box:

    • Micron 5300 PRO 960GB 2.5″  SSD x1

    Reviews

    There are no reviews yet.

    Be the first to review “Micron 5300 PRO 960GB 2.5 SSD”

    Your email address will not be published. Required fields are marked *